The Intelligent Thermal Fabric Driving AI
Phononic’s Thermal Fabric is a software-defined, TEC-enabled control layer that is converting thermal management into a real-time, system-level optimization across the entire AI data center. Enabling millisecond control of cooling, real-time thermal telemetry and analytics, workload-aware orchestration and seamless software integration, our solutions are cooling data centers in the present to unthrottled opportunities for the future.
Learn more about the Thermal Kit that is underpinning it all.
Reduce throttling.
Uplevel compute performance.
Deliver 3X ROI over 5 Years.
The moment is now for precise, millisecond response cooling for chip-level hotspots across the data center. From GPUs and xPUs, to rack and infrastructure including CDUs, switch ASICs and DIMMs, Phononic’s solutions are readily deployable, seamlessly scalable and consistently deliver real performance improvements.
ROI IN MONTHS
Reduce operational cost, enhance reliability and lifespan of hardware
Proven Performance
Less risk of throttling, even under high loads
MILLISECOND COOLING RESPONSE
Software enabled, real-time response vs. mechanical cooling
Extend Useful Life of Assets
Up to 5X life extension through throttling avoidance
Energy Efficient
Significantly reduce energy usage for cooling
Thermal Intelligence Hub
The latest thinking on data center challenges and opportunities
Phononic Thermal Kits: Solid State Cooling Solving the AI Thermal Bottleneck
Proven Cooling for Transceivers and Co-Packaged Optics in AI Data Centers
The Future of Data Center Cooling: Insights from NVIDIA GTC 2025
Lightwave Exclusive: Interview with Phononic at OFC 2025
Solid State Cooling: Unlock AI Performance With Phononic
Ushering In a New Era of AI Data Center Performance
Reduce GPU Throttling: Solid State Cooling for AI
AI Cooling Investments: Solid State TEC & 45°C Loops
Unthrottle AI Performance: Phononic Thermal Kit for GPU HBMs
CERN Case | Advanced Cooling | Phononic Design Superiority
Accelerating the Future of AI w/ Advanced Cooling Solution
Thermal Kit-Enabled CDU: 25% Energy Savings for AI Factories
GPU HBM Cooling | Achieve 60% TDP Gains with Constant Temp
Air-Cooled Data Centers: Unlock 20% TDP Gains
Data Center Cooling for AI, Edge & HPC
Larry Yang Podcast: Solid State Cooling for AI Data Centers
NVIDIA GTC 2025: HPC & GPU Cooling Insights
800G & 1.6T Cooling: Phononic Lightwave Interview | OFC 2025
OFC 2025: Cooling for 800G & 1.6T Transceivers
The Future of Cooling: 800G & 1.6T Optical Transceivers
SOLID STATE TECHNOLOGY
The Power of Solid State, Unleashed with Phononic's Innovative Design
Our solid state technology is redefining cooling.
Phononic’s precise, predictive and performance-enhancing cooling approach is redefining how we address the world’s toughest thermal challenges.
With hundreds of radically innovative IP patents across thermal management, design and system controls, Phononic is the leader in cooling innovation.
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Contact Us to Unleash Your AI Performance
Transforming Data Center Cooling With Solid State Design
Phononic’s Thermal Kit transforms cooling into a performance-critical, intelligent platform. The company is the global leader in solid state cooling, and its thermoelectric designs, IP portfolio, devices and reference design kits are the underpinning of the company’s thermal management fabric of AI infrastructure.