Cooling to Unthrottle AI Performance
Revolutionize your Data Center with Phononic’s Thermal Kit
ROI IN MONTHS
Reduce operational cost, enhance reliability and lifespan of hardware
Proven Performance
Less risk of throttling, even under high loads
MILLISECOND COOLING RESPONSE
Software enabled, real-time response vs. mechanical cooling
Scalable Platform
Efficiently scale cooling capacity for any size and application
Energy Efficient
Significantly reduce energy usage for cooling
Unleash AI Potential
Reduce throttling and uplevel compute performance with Phononic’s predictive, precise cooling deployed across AI accelerators to unleash their full potential. Phononic’s thermal kit delivers predictable, precise cooling anywhere heat is throttling your performance.
Applications
From thermoelectric cooling (TECs) to enable high-speed optical networking and communications, to precise, predictive cooling solutions to unleash AI compute performance in GPUs, xPUs, HBMs and more, Phononic is leading the marketing forward with revolutionary approaches to cooling across the data center.
Networking
Optics and Transceivers
Phononic enables high-speed optical communications in data centers, telecom and the optical edge.
AI Compute
GBU, xPU and HBM
Phononic’s innovative approach to data center cooling enables precise, predictive, performance-enhancing cooling at the node-level, or wherever throttling is hindering performance.
DC THOUGHT STACK
The latest thinking on data center challenges and opportunities
Thermal Kit: Cooling to Unthrottle AI Performance
Delivering Advanced Cooling Solutions for Pioneers like CERN Pushing the Limits of Science
Accelerating the Future of AI
Responsive CDUs for AI Factory Energy Efficiency
Improve performance; up to 60% gains in TDP with constant TCase versus industry standard.
Increase TDP While Maintaining Today’s Thermal Management Architecture
Innovative Approaches to Data Center Cooling for AI, Edge, and High-Performance Computing
Phononic’s CPO Talks Solid State Cooling on Global Podcast
The Future of Data Center Cooling: Insights from NVIDIA GTC 2025
Lightwave Exclusive: Interview with Phononic at OFC 2025
Experience the Future of Cooling at OFC 2025
The Future Belongs to the Cooled
SOLID STATE TECHNOLOGY
The Power of Solid State, Unleashed with Phononic's Innovative Design
Our solid state technology is redefining cooling.
Phononic’s precise, predictive and performance-enhancing cooling approach is redefining how we address the world’s toughest thermal challenges.
With hundreds of radically innovative IP patents across thermal management, design and system controls, Phononic is the leader in cooling innovation.
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Transforming Data Center Cooling With Solid State Design
Phononic’s Thermal Kit transforms cooling into a performance-critical, intelligent platform. The company is the global leader in solid state cooling, and its thermoelectric designs, IP portfolio, devices and reference design kits are the underpinning of the company’s thermal management fabric of AI infrastructure.